en:rules
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- | FIXME **This page is not fully translated, yet. Please help completing | + | FIXME **This page is not fully translated, yet. Please help complete |
====== Rules for designing new modules ====== | ====== Rules for designing new modules ====== | ||
- | This page serves as a wiki complement to an original article [[http://www.mlab.cz/ | + | This page serves as a wiki complement to an original article [[http://home.mlab.cz/ |
- | The module design itself uses a following [[en: | + | The module design itself uses the following [[en: |
===== Identification of modules ===== | ===== Identification of modules ===== | ||
- | Each modules | + | Each module |
- JTAGFT2232 - the name of the module, depicting the nature of the module (here probably a J-tag programmer with FTDI FT2232 chip). | - JTAGFT2232 - the name of the module, depicting the nature of the module (here probably a J-tag programmer with FTDI FT2232 chip). | ||
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- A - the module’s revision (in this case there were not corrections of any mistakes) | - A - the module’s revision (in this case there were not corrections of any mistakes) | ||
- | Furthermore there are modules with green non-soldering mask and white print and modules with white mask and green print. This kind of module identification was introduced by [[http:// | + | Furthermore, there are modules with green non-soldering mask and white print and modules with white mask and green print. This kind of module identification was introduced by [[http:// |
* **Green mask and white print** - a prototype module, often made only in one or few pieces serving as testing samples | * **Green mask and white print** - a prototype module, often made only in one or few pieces serving as testing samples | ||
- | * **White mask and black print** - a production version made in large quantities. Compared to the green version, it may contain tiny changes | + | * **White mask and black print** - a production version made in large quantities. Compared to the green version, it may contain tiny changes even if the module’s identification mark is identical. |
===== Creating a new module ===== | ===== Creating a new module ===== | ||
+ | |||
+ | ==== Using a GitHub template ==== | ||
+ | |||
+ | The probably simplest way how to make a new module structure is to create a new repository based on the [[https:// | ||
+ | |||
+ | The template repository should be used in [[https:// | ||
+ | |||
==== Using a mlabgen script ==== | ==== Using a mlabgen script ==== | ||
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==== Manual module creation ==== | ==== Manual module creation ==== | ||
- | If, for some reason, you are reluctant to use MLABgen for creation of the basic directory structure, it is necessary to comply with the following rules: | + | If for some reason, you are reluctant to use MLABgen for the creation of the basic directory structure, it is necessary to comply with the following rules: |
- | In the appropriate folder category we create a folder with the name of the new module using a format '' | + | In the appropriate folder category, we create a folder with the name of the new module using the format |
- | Inside the folder, we create the following directory structure (obligatory folders/ | + | |
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} | } | ||
- | You can find example of a correct filling by checking one of the already existing [[https:// | + | You can find an example of a correct filling by checking one of the already existing [[https:// |
===== Module power supply ===== | ===== Module power supply ===== | ||
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{{: | {{: | ||
- | **Power supply connectors are doubled in order to allow smyčkování napájení (??).** | + | **Power supply connectors are doubled in order to allow power looping** |
- | ==== Externí napájecí zdroje | + | ==== External power sources |
For power supply with higher powers, the FASTON connectors or WAGO256 terminal blocks are used. | For power supply with higher powers, the FASTON connectors or WAGO256 terminal blocks are used. | ||
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==== Sizes ==== | ==== Sizes ==== | ||
- | MLAB modules are designed in 10.16 mm raster (400 mils) and their sizes exceed 200 mils - 10 mils from the centres | + | MLAB modules are designed in 10.16 mm raster (400 mils) and their sizes exceed 200 mils - 10 mils from the centers |
- | An example of a module occupying 3 openings on the ALBASE: | + | An example of a module occupying 3 openings on the [[en: |
- | {{ :cs:modul.png?400 |}} | + | {{ :mlab_module_geometry_example.png?direct& |
- | | + | * Length of the edge: 4x10.16 - 0.254 -0.254 = 40.132 mm |
- | | + | * Screws’ pitch: 3x10.16 = 30.48 mm |
- | The distance of screw opening | + | * The distance of the screw hole center |
- | | + | * Screw hole diameter: 3 mm (MLAB footprint) |
==== Edge screws ==== | ==== Edge screws ==== | ||
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+ | Conductive traces (??) in PCB and their sizes are always chosen so even an amateur production and PCB mounting are supported as much as possible. Insulating distance are therefore maximal and spaces for components are chosen to be a bit longer than necessary (especially in case of QFN containers, where such approach makes a soldering quality check much easier). | ||
- | Vedení plošných spojů a jejich rozměry jsou vždy volené tak, aby byla v co největší míře umožněna i amatérská výroba a osazení plošného spoje. | + | The traces are furthermore design to minimise the possibility of modules’ emissions - this usually means to minimise the area of knots (?? Smyček), especially in case of boards with alternating currents of high amplitude |
- | Spoje jsou dále vedeny tak, aby se co nejvíce minimalizovala možnost vyzařování modulu, což znamená minimální plochy smyček zvláště u spojů, které vedou střídavé proudy s velkou amplitudou, typicky měniče ale třeba i výstupy logických obvodů typu CMOS a TTL. | + | In case of two-layer PCBs we prefer to use the upper side of the module (the one away from the base board) as a ground potential (??). If necessary, it is possible to have a low-voltage power supply led also in this side. However, it is quite crucial to avoid leading data or high-frequency signals in the top layer (again, due to possibility of emissions and reduction in the signal integrity). |
- | U dvouvrstvých plošných spojů je preferováno užití horní strany modulu | + | Modules should have all of the four screws connected with the same potential, even in cases when the module is not using the base board’s ground |
- | Moduly by měly mít všechny čtyři šrouby spojené stejným potenciálem a to pokud možno i v případě, kdy modul nepoužívá zem základové desky (Pokud to zvláštní konstrukční požadavky modulu nevylučují. Vy jímka je například [[cs:eth]]) tato praxe opět pomáhá snížit vyzařování modulu, zvláště u vícevrstvých plošných spojů. | + | === Components’ encasements === |
- | === Pouzdra součástek === | + | The preferred encasements for components are those from [[https:// |
- | Preferovaná pouzdra součástek jsou z našich [[https:// | + | The preferred size of SMD casing is currently 0805 series. |
- | Proferovaná velikost SMD pouzder je aktuálně řada 0805. | + | === Components’ placement === |
+ | SMD components are placed only at one side of the board - the one turned towards the base board, if possible (B.Cu layer). A reason for this placement is a greater toughness of the construction, | ||
- | === Rozmisteni soucastek | + | === Layers |
- | SMD součástky se umisťují výhradně na jednu stranu desky. Ideálně na stranu přivrácenou k základové desce (vrstva | + | F.Cu - top copper |
+ | | ||
+ | F.SilkS - silkscreen (components’ side) | ||
+ | B.SilkS - silkscreen (traces’ side ??) potisk strana spojů | ||
+ | F.Mask - soldermask (components’ side) | ||
+ | B.Mask - soldermask (traces’ side ??) maska strana spojů | ||
+ | Edge.Cuts - board outline | ||
+ | F.Fab - fabrication layer (components’ side) potisk pro osazování strana součástek | ||
+ | B.Fab - fabrication layer (potisk pro osazování strana spojů | ||
- | === Vrstvy === | ||
- | F.Cu - měděná vrstva ze strany součástek | + | When designing a two-layer PCB, one layer is reserved for grounding and power supply |
- | B.Cu - měděná vrstva ze strany spojů | + | |
- | F.SilkS - potisk součástek | + | |
- | B.SilkS - potisk strana spojů | + | |
- | F.Mask - maska strana součástek | + | |
- | B.Mask - maska strana spojů | + | |
- | Edge.Cuts - obrys desky | + | |
- | F.Fab - potisk pro osazování strana součástek | + | |
- | B.Fab - potisk pro osazování strana spojů | + | |
+ | === VIAs === | ||
- | + | **For usual traces** | |
- | + | 0.8 mm VIA’s diameter and 0.4 mm diameter for drilling | |
- | Pri navrhu dvouvrstveho plosneho spoje, je jedna vrstva se vyhrazena pro zem a napajeni. Tato vrstva se | + | |
- | pak nastaví jako " | + | |
- | napájení. To umožní automaticky ukončovat tyto spoje prokovem do této | + | |
- | vrstvy. | + | |
- | protoze v takovem případě se spoj špatně edituje. | + | |
- | + | ||
- | + | ||
- | === Prokovy === | + | |
- | + | ||
- | **Pro běžné cesty** | + | |
- | 0,8 mm průměr prokovu a 0,4 mm průměr vrtání | + | |
| | ||
- | Pro silové cesty je potřeba zvětšit rozměry prokovu, dle přenášených proudů, nebo zvýšit jejich počet. | + | For power traces, the dimensions of VIAs have to be enlarged depending on the currents, or their number have to be increased. |
| | ||
| | ||
- | **Mez výroby** | + | **Limits of production** |
- | | + | |
| | ||
V případech kde to není nutné nenavrhujeme na této mezi. Prodražuje cenu PCB. | V případech kde to není nutné nenavrhujeme na této mezi. Prodražuje cenu PCB. | ||
- | |||
Texty v potisku modulu nesmí překrývat prokovy. (Jinak dojde k nečitelnosti potisku v místě prokovu) | Texty v potisku modulu nesmí překrývat prokovy. (Jinak dojde k nečitelnosti potisku v místě prokovu) | ||
- | ==== Konstrukční části | + | ==== Construction parts ==== |
- | Na moduly kde zbývá volné místo na plošném spoje je možné umístit plošky pro rezervní součástky, obvykle rezistory, nebo kondenzátory v pouzdru 0805. Při vkládání součástek, je vhodné použít dvojitý | + | When a module has some free space left of a PCB, it is possible to place a spaces for backup components (usually resistors or condensers in 0850 encasement). During components fitting, it is recommended to use double |
=== LED === | === LED === | ||
- | Indikační LED jsou na modulech ideálně navrhovány tak, aby svítily skrz plošný spoj na od základní desky odvrácenou stranu. Toho je dosaženo vsazením | + | Modules’ indicator LEDs are preferably designed in a way that they shine through the PCB onto the side turned away from the base board. It can be achieved by placing a LED into a hole in a PCB - such kind of mounting is called “reverse mount” and there exist [[http:// |
- | Klasické | + | Classic |
- | === Krystaly | + | === Crystals |
- | Pro krystaly v modulech | + | As a basic case for crystals in MLAB modules, we have chosen |
- | {{: | + | {{: |
- | Pro moduly, kde lze předpokládat občasnou výměnu krystalu za krystal s jinou frekvencí se na modulech osazuje speciální držák krystalu, do kterého je možné po zkrácení nožiček krystal pohodlně zasunout | + | In case of modules, where we assume occasional exchanges of crystals for crystals with other frequencies, we fit them with a special crystal holder. After shortening the legs, crystals can be comfortably inserted into the holder and thus replaced by another crystal any time. |
- | {{: | + | {{: |
- | === Rezervní pozice pro součástky | + | === Backup positions for components |
- | Indikační LED mohou na modulech být v provedení | + | Modules’ indicator LEDs can be of SMD or LED 3 mm types. SMD diodes can be placed also on the bottom side of the board that is turned towards the base plate. In such case, it is recommended to design a hole of approximately 1 mm in diameter over the SMD LED, through which the LED will be visible. |
- | ===== Potisk na modulech | + | ===== Text / Legend printing on modules |
- | Potisk na modulech by měl respektovat obecná typografická pravidla. Je to důležité hlavně z hlediska nutnosti zachovat čitelnost potisku i po aplikaci sítotiskem. | + | Modules’ printings should respect a general typographical rules in order for it to be readable even after an application of screen printing. |
- | ==== Písmo | + | ==== Font ==== |
- | Na jednom modulu se může vyskytovat více velikostí písma, | + | One module can accommodate more font sizes (usually less than 3 is necessary). They are used in a following order: name of the module, legend, warnings, author’s id. Different sizes are of course used only in cases, when there is enough space on the module. Some modules have therefore only one font size - with respect to a good readability and module’s size. |
- | === Zarovnání | + | === Alignment |
- | Signály se stejnou prioritou by měly mít na celém modulu jednotnou velikost písma. Taktéž by měla být sjednocena velikost a styl jednotlivých popisků u jednoho konektoru. | + | Same priority signals should have the same font size across the whole module. Size and style of individual legends should also united in case of one connector. |
- | Popisky jednotlivých signálů na hřebínku se zarovnávají ke konektoru, aby byla minimalizována možnost řádkové chyby při zapojování. | ||
- | === Velikosti Písma === | + | Legend to individual signals on a pin should be aligned to connector in order to minimise a possibility of line error (?? Řádková chubs) when connecting. |
- | Nejčastější používané velikosti písma jsou: | + | === Font Sizes === |
- | Width 1,5 mm, Height 1,5mm, Thickness 0,3mm - název modulu, důležité informace a popisky hřebínků | + | Most commonly used font sizes are as follows: |
- | Width 1,3 mm, Height 1,3mm, Thickness 0,3mm - popisky jednotlivých vývodů hřebínků | + | |
- | Velikost písma menší než 1,3 mm je problematická a je třeba ji používat pouze v opodstatněných případech. | + | Width 1.5 mm, Height 1.5mm, Thickness 0.3mm - module name, important information and pins’ legends |
+ | Width 1.3 mm, Height 1.3mm, Thickness 0.3mm - legend to an individual pin nails (??) popisky jednotlivých vývodů hřebínků | ||
- | Na některých malých modulech může vzniknout problém s délkou názvu modulu, v takovém případě se název modulu zalamuje u verze modulu, například: | + | Font sizes smaller than 1.3 mm is problematic and it should only be use when there is a very good reason for it. |
+ | |||
+ | Some small modules might have a problem with length of their names - in such cases, the module’s name are wrapped to the next line at module version, for example: | ||
{{: | {{: | ||
- | ISL2902001A | + | ISL2902001A |
+ | |||
+ | ==== QR codes ==== | ||
- | ==== QR kódy ==== | + | All sufficiently large modules should have a QR code placed on them. It contains module’s identification and a link to a side with [[http:// |
- | Na všechny moduly které jsou dostatečně velké, aby na ně mohl být umístěn QR kód. Ten obsahuje identifikaci modulu a odkaz na stránku | + | |
qrencode -s 15 -l L " | qrencode -s 15 -l L " | ||
- | Pokud jste pro vytvoření modulu použili | + | If you have used mlabgen |
<WRAP info round> | <WRAP info round> | ||
- | Vhodnejší by pravděpodobně bylo použití | + | It will probably be better to use [[http:// |
</ | </ | ||
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=== PADS === | === PADS === | ||
- | Miho pro potřeby generování kódu do potisku plošného spoje vytvořil | + | In order to generate a code for PCB label, |
+ | Size of QR codes on PCBs is so far not unified. When generating codes, the default size is too large for most of PCBs. So far, an acceptable setting has to be tested , e.g. | ||
* PADS Size: 20 | * PADS Size: 20 | ||
* PADS Line Width: 2 | * PADS Line Width: 2 | ||
- | Vygenerovaný soubor je ve formě textu na spodní straně stránky. Text je tak nutné ručně vložit do souboru s příponou | + | The generated file is found at the bottom of the side as a text. The text has to be manually inserted into a file with asc. suffix. After importing the generated picture into a PCB’s printing, its attribute has to be set as “solid copper” so that the motive will be entirely filled in with colour. |
=== KiCAD === | === KiCAD === | ||
- | Obrázky QRkódů se do KiCAD | + | QRcode pictures can be |
- | ===== Check list před výrobou | + | ===== Check list before production |
- | - zkontrolovat velikost | + | - check if the encasements are right and of a good size |
- | - Velikost plosek u konektoru a soucastek skrz desku. | + | - check the size of connector’s spaces (??ploška) and sizes of components that go through the board |
- | - velikost der, krystaly ledky, hrebinky, propojky, specialni soucastky. | + | - check the sizes of holes, LED crystals, pins (hřebík?? |
- | - odmaskovani | + | - check the unmasking of (??) plošek |
- | - obrysy soucastek, oznaceni propojek. | + | - check the components’ outlines and labelling of jumpers (??) |
- | - popisky, napis www.mlab.cz | + | - check the labels and legends, www.mlab.cz |
- | - Zkontrolovat, | + | - check that the VIAs are not under letters and symbols |
- | - zkontrolovat | + | - check the QR code and PermaLink |
- | ===== Struktura repozitáře MLABu ===== | + | ===== MLAB repository structure===== |
- | * Projektová | + | * Project |
- | * Commit message - začátek velké písmeno, slova jako added, fixed, removed, started, finished... | + | * Commit message - begins with capital latter; uses words such as: added, fixed, removed, started, finished... |
- | ==== Jmenná konvence | + | ==== Name convention |
- | bez_diakritiky_a_specialnich_znaku_mezery_nahrazeny_podtrzitkem_pouze_mala_pismena_strucne_a_srozumitelne | + | withouth_diacritic_and_special_cases_spaces_are_replaced_by_an_underscore_lowercase_letters_only_briefly_and_comprehensibly |
- | ==== Adersářová struktura modulu | + | ==== |
MODUL01A/ | MODUL01A/ |
en/rules.txt · Last modified: 2023/02/03 00:14 by kaklik